Process directions
Copper plating can act as a strike underlayer and a transition for subsequent coatings, or bright acid systems can be chosen for appearance and ductility. The alkaline and acid processes in our data serve different purposes and should be evaluated separately.
| Direction | Use | Key points to confirm |
|---|---|---|
| Alkaline copper plating | Underlayer copper plating for substrates such as steel, copper and zinc die-castings; our data includes pyrophosphate and bright alkaline directions. | Confirm substrate activation, strike requirements and subsequent coatings. |
| Bright acid copper plating | Focus on leveling, ductility and brightness; usable on various metal substrates and in the copper step after plastics metallization. | Verify by surface roughness, target thickness and appearance sample panel. |
Please specify when submitting requirements
Provide the substrate, pretreatment state, whether a strike underlayer or decorative appearance is needed, target thickness and subsequent coating types. Cyanide and cyanide-free processes cannot be inferred from category names; specific bath composition and management conditions must be confirmed with the corresponding technical and safety data.
The above is organized by application from the provided product catalog and data and serves as a selection starting point. Specific formulations, applicable substrates, process windows and inspection requirements should be confirmed with the corresponding technical data and sample verification.